Processor: Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 cores per processor Intel C620 series chipset with optional Intel QuickAssist Technology
Memory: Up to 32 x DDR4 RDIMM (2TB), LRDIMM (4TB), bandwidth up to 3200 MT/S
Persistent Memory: Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled
Processor: Up to two 3rd Generation Intel® Xeon® Scalable processors with up to 40 cores per processor Intel C620 series chipset with optional Intel QuickAssist Technology
Memory: Up to 32 x DDR4 RDIMM (2TB), LRDIMM (4TB), bandwidth up to 3200 MT/S
Persistent Memory: Supports up to 16 Intel Persistent Memory 200 series (BPS) slots with a maximum total capacity of 7.68 TB per sled
Storage Controllers:
Internal controllers: PERC H755 MX, PERC H745P MX, HBA350i MX, S150
Boot Optimized Storage Subsystem (BOSS-S1): HWRAID 2 x M.2 SSDs 240 GB or 480 GB or Internal Dual SD Module (IDSDM) or USB
External PERC (RAID): PERC H745P MX
External HBAs (non-RAID): HBA330 MMZ
Drive Bays: Front Bays: Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 7.6 TB per drive Up to 6 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 7.6 TB per drive
PCI-Express:
One x16 PCIe Gen4 slot for Mezz A – connected to processor 1
One x16 PCIe Gen4 slot for Mezz B – connected to processor 2
One x16 PCIe Gen4 slot for mini-Mezz card – connected to processor 2
One x16 PCIe Gen4 slot for PERC – connected to processor 1
Two x8 PCIe Gen4 connectors for NVMe drive – connected to processor 1
One x8 PCIe Gen4 connector for NVMe drive – connected to processor 2
Two x4 PCIe Gen3 slots for BOSS M.2 HW RAID card – connected to Platform Controller Hub (PCH)
I/O Ports : Front Ports 1 x iDRAC Direct port (Micro-AB USB) 1 x USB 3.0 Internal Ports: 1 x USB 3.0
Power Supply: MX7000 chassis: Up to six 3000 W AC Platinum PSU and grid redundancy support
Form Factor: Up to 8 independent hot-swappable, 1U single-width compute sled in a MX7000 chassis